This lab is approximately 5,000 square feet of class 10/100 clean room with full microlithography, characterization and packaging for advanced MEMS, microelectronics and microsystems fabrication. This lab has over $7.1 million of state-of-the-art equipment donated by Delphi Corp. For a comprehensive equipment list click here. The clean room facilities contain microelectronic fabrication facilities for up to 6-inch wafers from basic processing to metrology and packaging. The clean room bays are outlined as follows:
Wafer processing bay with an advanced 10-tube-processing furnace for oxide, nitride, oxynitride, PECVD and high-temperature processing of hundreds of wafers per
batch with eight tubes for different processes
Plasma etching facilities that include plasma enhanced chemical etching and deep trench etching facilities
Wet etching and chemical processing bay for wet chemistry
Class 10 photolithography bay with manual and automatic wafer coating, mask alignment and development
Metallization bay with sputter deposition and electron beam evaporation deposition systems
Silicon-plus bay with production plasma source molecular beam epitaxy (PSMBE) system for deposition of wide bandgap semiconductors on up to six inch diameter wafers
Metrology and packaging bay for device measurement, wire bonding and device packaging facilities
